Inventor
TANADI TRISMARDAWI
US9 patents
Patents
9 patentsUS9305905B2Apr 5, 2016
Apparatuses and related methods for staggering power-up of a stack of semiconductor dies
MICRON TECHNOLOGY INC6 citations81
US11092990B2Aug 17, 2021
Apparatuses and related methods for staggering power-up of a stack of semiconductor dies
MICRON TECHNOLOGY INC1 citations70
US10120404B2Nov 6, 2018
Apparatuses and related methods for staggering power-up of a stack of semiconductor dies
MICRON TECHNOLOGY INC3 citations70
US11107795B2Aug 31, 2021
Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture
MICRON TECHNOLOGY INC2 citations69
US10388630B2Aug 20, 2019
Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture
MICRON TECHNOLOGY INC1 citations69
US9875993B2Jan 23, 2018
Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture
MICRON TECHNOLOGY INC2 citations69
US11594522B2Feb 28, 2023
Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture
MICRON TECHNOLOGY INC0 citations59
US9785171B2Oct 10, 2017
Apparatuses and related methods for staggering power-up of a stack of semiconductor dies
MICRON TECHNOLOGY INC0 citations49
US12045482B2Jul 23, 2024
Wordline leakage test management
MICRON TECHNOLOGY INC0 citations41