Inventor
MANACK CHRISTOPHER DANIEL
US48 patents
Patents
48 patentsUS10453817B1Oct 22, 2019
Zinc-cobalt barrier for interface in solder bond applications
TEXAS INSTRUMENTS INC7 citations83
US11942386B2Mar 26, 2024
Electronic devices in semiconductor package cavities
TEXAS INSTRUMENTS INC2 citations72
US10692830B2Jun 23, 2020
Multilayers of nickel alloys as diffusion barrier layers
TEXAS INSTRUMENTS INC2 citations72
US11387155B2Jul 12, 2022
IC having a metal ring thereon for stress reduction
TEXAS INSTRUMENTS INC2 citations71
US11380637B2Jul 5, 2022
Efficient redistribution layer topology
TEXAS INSTRUMENTS INC2 citations71
US11562949B2Jan 24, 2023
Semiconductor package including undermounted die with exposed backside metal
TEXAS INSTRUMENTS INC6 citations68
US12237219B2Feb 25, 2025
Contact with bronze material to mitigate undercut
TEXAS INSTRUMENTS INC0 citations62
US12068221B2Aug 20, 2024
Plating for thermal management
TEXAS INSTRUMENTS INC0 citations62
US12062597B2Aug 13, 2024
Three dimensional package for semiconductor devices and external components
TEXAS INSTRUMENTS INC0 citations62
US11631632B2Apr 18, 2023
Three dimensional package for semiconductor devices and external components
TEXAS INSTRUMENTS INC0 citations62
US11594504B2Feb 28, 2023
Nickel alloy for semiconductor packaging
TEXAS INSTRUMENTS INC0 citations62
US11587858B2Feb 21, 2023
Zinc-cobalt barrier for interface in solder bond applications
TEXAS INSTRUMENTS INC0 citations62
US11127515B2Sep 21, 2021
Nanostructure barrier for copper wire bonding
TEXAS INSTRUMENTS INC0 citations62
US11011488B2May 18, 2021
Zinc-cobalt barrier for interface in solder bond applications
TEXAS INSTRUMENTS INC0 citations62
US11011483B2May 18, 2021
Nickel alloy for semiconductor packaging
TEXAS INSTRUMENTS INC0 citations62
US10566267B2Feb 18, 2020
Die attach surface copper layer with protective layer for microelectronic devices
TEXAS INSTRUMENTS INC1 citations62
US12255115B2Mar 18, 2025
Electronic devices in semiconductor package cavities
TEXAS INSTRUMENTS INC0 citations61
US12203776B2Jan 21, 2025
Miniature sensor cavities
TEXAS INSTRUMENTS INC0 citations61
US11984418B2May 14, 2024
Method of forming brass-coated metals in flip-chip redistribution layers
TEXAS INSTRUMENTS INC0 citations61
US11978709B2May 7, 2024
Integrated system-in-package with radiation shielding
TEXAS INSTRUMENTS INC0 citations61
US11869820B2Jan 9, 2024
IC having a metal ring thereon for stress reduction
TEXAS INSTRUMENTS INC0 citations61
US11410947B2Aug 9, 2022
Brass-coated metals in flip-chip redistribution layers
TEXAS INSTRUMENTS INC0 citations61
US11362047B2Jun 14, 2022
Integrated system-in-package with radiation shielding
TEXAS INSTRUMENTS INC0 citations61
US12525500B2Jan 13, 2026
Coated semiconductor dies
TEXAS INSTRUMENTS INC0 citations60
US12142586B2Nov 12, 2024
Efficient redistribution layer topology
TEXAS INSTRUMENTS INC0 citations60
US12074096B2Aug 27, 2024
Die attach surface copper layer with protective layer for microelectronic devices
TEXAS INSTRUMENTS INC0 citations60
US11854922B2Dec 26, 2023
Semicondutor package substrate with die cavity and redistribution layer
TEXAS INSTRUMENTS INC0 citations60
US11837518B2Dec 5, 2023
Coated semiconductor dies
TEXAS INSTRUMENTS INC0 citations60
US11616038B2Mar 28, 2023
Interconnect for electronic device
TEXAS INSTRUMENTS INC0 citations60
US11855024B2Dec 26, 2023
Wafer chip scale packages with visible solder fillets
TEXAS INSTRUMENTS INC0 citations59
US11664276B2May 30, 2023
Front side laser-based wafer dicing
TEXAS INSTRUMENTS INC0 citations59
US12512416B2Dec 30, 2025
Laser ablation for die separation to reduce laser splash and electronic device
TEXAS INSTRUMENTS INC0 citations57
US11443996B2Sep 13, 2022
Zinc layer for a semiconductor die pillar
TEXAS INSTRUMENTS INC0 citations57
US11362020B2Jun 14, 2022
Flipchip package with an IC having a covered cavity comprising metal posts
TEXAS INSTRUMENTS INC0 citations57
US11121076B2Sep 14, 2021
Semiconductor die with conversion coating
TEXAS INSTRUMENTS INC0 citations52
US10714417B2Jul 14, 2020
Semiconductor device with electroplated die attach
TEXAS INSTRUMENTS INC0 citations52
US10607931B2Mar 31, 2020
Semiconductor device with electroplated die attach
TEXAS INSTRUMENTS INC0 citations52
US9321631B2Apr 26, 2016
Method for embedding controlled-cavity MEMS package in integration board
TEXAS INSTRUMENTS INC0 citations52
US10796956B2Oct 6, 2020
Contact fabrication to mitigate undercut
TEXAS INSTRUMENTS INC0 citations51
US10734304B2Aug 4, 2020
Plating for thermal management
TEXAS INSTRUMENTS INC0 citations51
US10629334B2Apr 21, 2020
Nanostructure barrier for copper wire bonding
TEXAS INSTRUMENTS INC0 citations51
US12394671B2Aug 19, 2025
Efficient removal of street test devices during wafer dicing
TEXAS INSTRUMENTS INC0 citations50
US12009319B2Jun 11, 2024
Integrated circuit with metal stop ring outside the scribe seal
TEXAS INSTRUMENTS INC0 citations50
US10833036B2Nov 10, 2020
Interconnect for electronic device
TEXAS INSTRUMENTS INC0 citations50
US12100678B2Sep 24, 2024
Conductive members for die attach in flip chip packages
TEXAS INSTRUMENTS INC0 citations48
US10840211B2Nov 17, 2020
Semiconductor package with leadframe having pre-singulated leads or lead terminals
TEXAS INSTRUMENTS INC0 citations45
US10424552B2Sep 24, 2019
Alloy diffusion barrier layer
TEXAS INSTRUMENTS INC0 citations41
US9768130B2Sep 19, 2017
Integrated power package
TEXAS INSTRUMENTS INC0 citations41