Inventor
MURRAY JACK E
US10 patents
⚠️ This page may combine multiple inventors who share the name “MURRAY JACK E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
8 patentsUS9418926B1Aug 16, 2016
Package-on-package semiconductor assemblies and methods of manufacturing the same
MICRON TECHNOLOGY INC19 citations92
US10032703B2Jul 24, 2018
Package-on-package semiconductor assemblies and methods of manufacturing the same
MICRON TECHNOLOGY INC5 citations83
US11139229B2Oct 5, 2021
Package-on-package semiconductor assemblies and methods of manufacturing the same
MICRON TECHNOLOGY INC2 citations72
US10825761B2Nov 3, 2020
Electronic devices having tapered edge walls
MICRON TECHNOLOGY INC2 citations72
US10381297B2Aug 13, 2019
Package-on-package semiconductor assemblies and methods of manufacturing the same
MICRON TECHNOLOGY INC3 citations72
US11791252B2Oct 17, 2023
Package-on-package semiconductor assemblies and methods of manufacturing the same
MICRON TECHNOLOGY INC0 citations62
US10825762B2Nov 3, 2020
Methods of processing semiconductor devices
MICRON TECHNOLOGY INC0 citations51
US10276479B1Apr 30, 2019
Methods of processing semiconductor devices
MICRON TECHNOLOGY INC0 citations51