Inventor
LIAO KUAN-NENG
TW4 patents
Patents
4 patentsUS6483187B1Nov 19, 2002
Heat-spread substrate
ADVANCED SEMICONDUCTOR ENG61 citations93
US6624523B2Sep 23, 2003
Structure and package of a heat spreader substrate
ADVANCED SEMICONDUCTOR ENG41 citations90
US6918178B2Jul 19, 2005
Method of attaching a heat sink to an IC package
ADVANCED SEMICONDUCTOR ENG26 citations88
US6429049B1Aug 6, 2002
Laser method for forming vias
ADVANCED SEMICONDUCTOR ENG3 citations57