Inventor

WU EN-CHIEH

TW3 patents

Patents

3 patents

US7015130B2Mar 21, 2006

Method for making UBM pads and bumps on wafer

ADVANCED SEMICONDUCTOR ENG9 citations69

US7261828B2Aug 28, 2007

Bumping process

ADVANCED SEMICONDUCTOR ENG2 citations60

US7402510B2Jul 22, 2008

Etchant and method for forming bumps

ADVANCED SEMICONDUCTOR ENG0 citations39