Inventor
KILCOYNE SEAN P
US25 patents
⚠️ This page may combine multiple inventors who share the name “KILCOYNE SEAN P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RAYTHEON CO
21 patentsUS10515837B2Dec 24, 2019
Method of wafer bonding of dissimilar thickness die
RAYTHEON CO2 citations73
US10847569B2Nov 24, 2020
Wafer level shim processing
RAYTHEON CO3 citations68
US10847419B2Nov 24, 2020
Stress compensation and relief in bonded wafers
RAYTHEON CO4 citations66
US11222813B2Jan 11, 2022
Method of manufacturing wafer level low melting temperature interconnections
RAYTHEON CO0 citations62
US11710756B2Jul 25, 2023
Integrating optical elements with electro-optical sensors via direct-bond hybridization
RAYTHEON CO0 citations61
US12051712B2Jul 30, 2024
Close butted collocated variable technology imaging arrays on a single ROIC
RAYTHEON CO0 citations60
US11705471B2Jul 18, 2023
Close butted collocated variable technology imaging arrays on a single ROIC
RAYTHEON CO0 citations60
US12349475B2Jul 1, 2025
Integrated circuit having vertical routing to bond pads
RAYTHEON CO0 citations59
US12148721B2Nov 19, 2024
Iterative formation of damascene interconnects
RAYTHEON CO0 citations59
US11837623B2Dec 5, 2023
Integrated circuit having vertical routing to bond pads
RAYTHEON CO0 citations59
US11430753B2Aug 30, 2022
Iterative formation of damascene interconnects
RAYTHEON CO0 citations59
US11393869B2Jul 19, 2022
Wafer level shim processing
RAYTHEON CO0 citations58
US12278255B2Apr 15, 2025
Thin film obscurant for microelectronics
RAYTHEON CO0 citations55
US11886095B2Jan 30, 2024
Scalable unit cell device for large two-dimensional arrays with integrated phase control
RAYTHEON CO0 citations53
US10504777B2Dec 10, 2019
Method of manufacturing wafer level low melting temperature interconnections
RAYTHEON CO0 citations51
US11750945B2Sep 5, 2023
Imager with integrated asynchronous laser pulse detection having a signal component along a second electrical pathway passes through an ALPD readout integrated circuit to an imaging readout integrated circuit
RAYTHEON CO0 citations49
US10672826B2Jun 2, 2020
Segmented channel stop grid for crosstalk mitigation in visible imaging arrays
RAYTHEON CO0 citations49
US12261186B2Mar 25, 2025
Mosaic focal plane array
RAYTHEON CO0 citations48
US10879291B2Dec 29, 2020
Stacked sensor with integrated capacitors
RAYTHEON CO0 citations46
US10418406B2Sep 17, 2019
Hybrid sensor chip assembly and method for reducing radiative transfer between a detector and read-out integrated circuit
RAYTHEON CO0 citations45
US10236226B2Mar 19, 2019
In-situ calibration structures and methods of use in semiconductor processing
RAYTHEON CO0 citations36