Inventor
KUO CHIU-PIEN
TW2 patents
Patents
2 patentsUS9653320B2May 16, 2017
Methods for etching a hardmask layer for an interconnection structure for semiconductor applications
APPLIED MATERIALS INC5 citations62
US9960052B2May 1, 2018
Methods for etching a metal layer to form an interconnection structure for semiconductor applications
APPLIED MATERIALS INC1 citations48