Inventor

KIM OHSUG

KR5 patents

⚠️ This page may combine multiple inventors who share the name “KIM OHSUG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

3 patents

US7635913B2Dec 22, 2009

Stacked integrated circuit package-in-package system

STATS CHIPPAC LTD7 citations72

US7833840B2Nov 16, 2010

Integrated circuit package system with down-set die pad and method of manufacture thereof

STATS CHIPPAC LTD6 citations71

US7968371B2Jun 28, 2011

Semiconductor package system with cavity substrate

STATS CHIPPAC LTD2 citations54

KIM OHSUG

2 patents

US8089166B2Jan 3, 2012

Integrated circuit package with top pad

KIM OHSUG12 citations78

US8617924B2Dec 31, 2013

Stacked integrated circuit package-in-package system and method of manufacture thereof

KIM OHSUG4 citations59