Inventor
ESPIRITU EMMANUEL A
SG13 patents
⚠️ This page may combine multiple inventors who share the name “ESPIRITU EMMANUEL A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CAMACHO ZIGMUND R
5 patentsUS8993376B2Mar 31, 2015
Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die
CAMACHO ZIGMUND R52 citations98
US8409922B2Apr 2, 2013
Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect
CAMACHO ZIGMUND R58 citations98
US9006031B2Apr 14, 2015
Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumps
CAMACHO ZIGMUND R40 citations94
US8076184B1Dec 13, 2011
Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die
CAMACHO ZIGMUND R43 citations94
US8241956B2Aug 14, 2012
Semiconductor device and method of forming wafer level multi-row etched lead package
CAMACHO ZIGMUND R25 citations92
STATS CHIPPAC LTD
4 patentsUS7687892B2Mar 30, 2010
Quad flat package
STATS CHIPPAC LTD14 citations90
US8866275B2Oct 21, 2014
Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect
STATS CHIPPAC LTD8 citations84
US7659608B2Feb 9, 2010
Stacked die semiconductor device having circuit tape
STATS CHIPPAC LTD4 citations59
US7786575B2Aug 31, 2010
Stacked die semiconductor device having circuit tape
STATS CHIPPAC LTD1 citations49