Inventor

KOGISO TETSUYA

JP6 patents

⚠️ This page may combine multiple inventors who share the name “KOGISO TETSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KANEKA CORP

2 patents

US10975263B2Apr 13, 2021

Thermosetting resin composition, cured film and method for producing same, and flexible printed board with cured film and method for producing same

KANEKA CORP0 citations55

US10822465B2Nov 3, 2020

Black resin composition, polyimide with black resin cured film and production method therefor, and flexible printed wiring board using black resin cured film

KANEKA CORP0 citations48

SEKITO YOSHIHIDE

1 patent

US9835942B2Dec 5, 2017

Photosensitive resin composition and use thereof

SEKITO YOSHIHIDE2 citations69

KIDO MASAYOSHI

1 patent

US8828525B2Sep 9, 2014

Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plate

KIDO MASAYOSHI2 citations58

KODA TOMOHIRO

1 patent

US9081276B2Jul 14, 2015

Photosensitive resin composition production kit, and use thereof

KODA TOMOHIRO2 citations56

FUJIHARA KAN

1 patent

US8754186B2Jun 17, 2014

Polyimide precursor composition, use thereof and production method thereof

FUJIHARA KAN2 citations55