Inventor · disambiguated record
Vinodhkumar Raghunathan
Also filed as: RAGHUNATHAN VINODHKUMAR
6 granted patents·34 citations·filing 2012–2016
81Inventor score
Top patents by PatentIndex Score
6 records- 0192US9368401B2Embedded structures for package-on-package architectureINTEL CORP·Filed 2014·Granted Jun 14, 2016·13 cites·19 claims
- 0290US8866287B2Embedded structures for package-on-package architectureINTEL CORP·Filed 2012·Granted Oct 21, 2014·11 cites·15 claims
- 0385US9748177B2Embedded structures for package-on-package architectureINTEL CORP·Filed 2016·Granted Aug 29, 2017·4 cites·20 claims
- 0482US9633837B2Methods of providing dielectric to conductor adhesion in package structuresINTEL CORP·Filed 2015·Granted Apr 25, 2017·3 cites·16 claims
- 0571US9136221B2Methods of providing dielectric to conductor adhesion in package structuresINTEL CORP·Filed 2012·Granted Sep 15, 2015·2 cites·21 claims
- 0656US9451696B2Embedded architecture using resin coated copperSENEVIRATNE DILAN·Filed 2012·Granted Sep 20, 2016·1 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →