Inventor
PUGATSCHOW ANTON
DE4 patents
Patents
4 patentsUS10074590B1Sep 11, 2018
Molded package with chip carrier comprising brazed electrically conductive layers
INFINEON TECHNOLOGIES AG16 citations89
US10115688B2Oct 30, 2018
Solder metallization stack and methods of formation thereof
INFINEON TECHNOLOGIES AG2 citations70
US10283432B2May 7, 2019
Molded package with chip carrier comprising brazed electrically conductive layers
INFINEON TECHNOLOGIES AG0 citations49
US10573611B2Feb 25, 2020
Solder metallization stack and methods of formation thereof
INFINEON TECHNOLOGIES AG0 citations47