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Inventor
SOBKOWIAK MARCO
DE
2 patents
Patents
2 patents
US10074590B1
Sep 11, 2018
Molded package with chip carrier comprising brazed electrically conductive layers
INFINEON TECHNOLOGIES AG
16 citations
89
US10283432B2
May 7, 2019
Molded package with chip carrier comprising brazed electrically conductive layers
INFINEON TECHNOLOGIES AG
0 citations
49