Inventor
SAWAFUJI SUSUMU
JP5 patents
Patents
5 patentsUS4852304AAug 1, 1989
Apparatus and method for slicing a wafer
TOKYO SEIMITSU CO LTD24 citations90
US4894956AJan 23, 1990
Apparatus and method for slicing a wafer
TOKYO SEIMITSU CO LTD9 citations71
US7117719B2Oct 10, 2006
Hole shape measuring method and apparatus
TOKYO SEIMITSU CO LTD7 citations70
US5836808ANov 17, 1998
Slicing machine with built-in grinder
TOKYO SEIMITSU CO LTD1 citations47
US4838238AJun 13, 1989
Internal peripheral edge type blade holding device
TOKYO SEIMITSU CO LTD1 citations44