Inventor

YEE KUO-CHUNG

TW196 patents

⚠️ This page may combine multiple inventors who share the name “YEE KUO-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YEE KUO-CHUNG

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device and method

Semiconductor packages and methods of forming same

Fan-out stacked system in package (SIP) and the methods of making the same

Semiconductor package structure having am antenna pattern and manufacturing method thereof

Devices, packaged semiconductor devices, and semiconductor device packaging methods

Methods of forming multi-die package structures including redistribution layers

Integrated circuit package and methods of forming same

Fan-out stacked system in package (SIP) and the methods of making the same

Package structure and method of forming the same

Semiconductor package and manufacturing method thereof

Package structure and manufacturing method thereof

Fan-out stacked system in package (SIP) and the methods of making the same

Integrated fan-out stacked package with fan-out redistribution layer (RDL)

Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors

Method of manufacturing an integrated stacked package with a fan-out redistribution layer (RDL) and a same encapsulating process

Packages and methods of manufacture thereof

Packaged semiconductor device and method of forming thereof

Package and method of manufacturing the same

Integrated circuit packages comprising a plurality of redistribution structures and methods of forming the same

Compute-in-memory packages and methods forming the same

Package structure and manufacturing method thereof

Semiconductor structure comprising at least one system-on-integrated-circuit component

Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors

Package structure and manufacturing method thereof

Semiconductor packages and methods of forming same

Semiconductor device including through die via and manufacturing method thereof

Wafer level package structure and method of forming same

Package having redistribution layer structure with protective layer and method of fabricating the same

Package structure and manufacturing method thereof

Package-on-package structure and manufacturing method thereof

Methods of forming multi-die package structures including redistribution layers

Antenna device and method for manufacturing antenna device

Methods and apparatus for sensor module

Manufacturing method of a package structure

Integrated fan-out package and method for fabricating the same

ADVANCED SEMICONDUCTOR ENG

Semiconductor package structure and method for manufacturing the same

Semiconductor package and method for manufacturing the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Optical component package and packaging including an optical component horizontally attached to a substrate

Water-level package with bump ring

Wafer-level package with a cavity and fabricating method thereof

Microsystem package structure

Multichip wafer-level package and method for manufacturing the same

Optical integrated circuit element package and process for making the same

YEE KUO-CHUNG

Methods and apparatus for sensor module

Method for making a stackable package

TAIWAN SEMICONDUCTOR MFG

Chip on package structure and method