Inventor

WANG TSUNG-DING

TW110 patents

⚠️ This page may combine multiple inventors who share the name “WANG TSUNG-DING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG TSUNG-DING

TAIWAN SEMICONDUCTOR MFG CO LTD

Stacked semiconductor devices and methods of forming same

Methods of forming multi-die package structures including redistribution layers

Redistribution structures in semiconductor packages and methods of forming same

Substrate design for semiconductor packages and method of forming same

Package structures and methods of forming the same

Semiconductor package

Package-on-package structure with organic interposer

Substrate design for semiconductor packages and method of forming same

Methods of forming multi-die package structures including redistribution layers

Substrate design for semiconductor packages and method of forming same

Dam for three-dimensional integrated circuit

Thermal performance structure for semiconductor packages and method of forming same

3D integrated circuit package processing with panel type lid

Concentric bump design for the alignment in die stacking

Semiconductor package including a substrate with a stepped sidewall structure

Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof

Package structure comprising buffer layer for reducing thermal stress and method of forming the same

Semiconductor packages and methods of forming the same

Package structure comprising buffer layer for reducing thermal stress and method of forming the same

Thermal performance structure for semiconductor packages and method of forming same

Semiconductor package and manufacturing method thereof

Semiconductor package and semiconductor device

Substrate design for semiconductor packages and method of forming same

Dam for three-dimensional integrated circuit

Packages with stacked dies and methods of forming the same

Substrate design for semiconductor packages and method of forming same

Package assembly

Post-passivation interconnect structure and method of forming the same

POP structures with dams encircling air gaps and methods for forming the same

Integrated fan-out package and method of fabricating the same

Underfill dispensing with controlled fillet profile

Integrated fan-out package and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG

Packages with stacked dies and methods of forming the same

Cooling channels in 3DIC stacks

Package on package structures and methods for forming the same

Method for producing stackable dies

WANG TSUNG-DING

Semiconductor package having a recess filled with a molding compound

Package on package devices and methods of packaging semiconductor dies

Wafer-level molded structure for package assembly

CHENG JUNG WEI

Package on package structures and methods for forming the same

Mold chase design for package-on-package applications

LEE BO-I

Delamination resistance of stacked dies in die saw

LIN HUNG-JEN

Package assembly and method of forming the same

HSIAO C W

Method of forming stacked-die packages

CHEN HSIEN-WEI

Wafer-level chip scale package with re-workable underfill

YU CHEN-HUA

Package structures and methods for forming the same

TSENG MING-HONG

Three-dimensional integrated circuit stacking-joint interface structure

CHING KAI-MING

Cooling channels in 3DIC stacks

PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC

Multi-die package structures including redistribution layers

WANG TSUNG DING

System in package process flow