Inventor
MENDONCA JOHN
US14 patents
⚠️ This page may combine multiple inventors who share the name “MENDONCA JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
5 patentsUS6444569B2Sep 3, 2002
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
MOTOROLA INC60 citations95
US6274478B1Aug 14, 2001
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
MOTOROLA INC70 citations95
US5985748ANov 16, 1999
Method of making a semiconductor device using chemical-mechanical polishing having a combination-step process
MOTOROLA INC98 citations95
US6093966AJul 25, 2000
Semiconductor device with a copper barrier layer and formation thereof
MOTOROLA INC116 citations94
US6573173B2Jun 3, 2003
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
MOTOROLA INC23 citations91
HEWLETT PACKARD DEVELOPMENT CO
4 patentsUS7712133B2May 4, 2010
Integrated intrusion detection system and method
HEWLETT PACKARD DEVELOPMENT CO46 citations91
US7143121B2Nov 28, 2006
Method and system for archiving and restoring data from an operations center in a utility data center
HEWLETT PACKARD DEVELOPMENT CO19 citations89
US7590738B2Sep 15, 2009
Method and system for processing concurrent events in a provisional network
HEWLETT PACKARD DEVELOPMENT CO8 citations83
US7523503B2Apr 21, 2009
Method for protecting security of network intrusion detection sensors
HEWLETT PACKARD DEVELOPMENT CO5 citations62