Inventor

Mao yi-chao

TW24 patents

⚠️ This page may combine multiple inventors who share the name “Mao yi-chao”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

Mao yi-chao

TAIWAN SEMICONDUCTOR MFG CO LTD

Fan-out packages and methods of forming same

Structure and formation method of package structure with stacked semiconductor dies

Method and system for substrate thinning

Grinding element, grinding wheel and manufacturing method of semiconductor package using the same

Method of singulating a semiconductor device

Package structure with stacked semiconductor dies

Apparatus for detecting end point

Apparatus for detecting end point

System for thinning substrate

Methods and structures for packaging semiconductor dies

Method for substrate thinning

Apparatus and method for detecting end point

Integrated circuit structure, and method for forming thereof

Integrated circuit structure, and method for forming thereof

Integrated circuit structure, and method for forming thereof

Methods and structures for packaging semiconductor dies

Package with a fan-out structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG

Package with a fan-out structure and method of forming the same

Method of packaging a semiconductor device

Grinding wheel design with elongated teeth arrangement

HUNG JUI-PIN

Packaging methods and structures using a die attach film

LIN JING-CHENG

Packaged semiconductor device with a molding compound and a method of forming the same

WANG CHUNG YU

Methods for de-bonding carriers

Mao yi chao

End point detection in grinding