Inventor
LAI PO-CHEN
TW54 patents
Patents
50 patentsUS12261102B2Mar 25, 2025
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations74
US11967582B2Apr 23, 2024
Multi-chip device and method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11915991B2Feb 27, 2024
Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11637087B2Apr 25, 2023
Multi-chip device and method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11282756B2Mar 22, 2022
Organic interposer including stress-resistant bonding structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12255156B2Mar 18, 2025
Semiconductor package with riveting structure between two rings and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12557645B2Feb 17, 2026
Semiconductor packages with thermal lid and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12512399B2Dec 30, 2025
Semiconductor package and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12506090B2Dec 23, 2025
Semiconductor package including stress buffers and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12500208B2Dec 16, 2025
Integrated fan-out package having stress release structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12374636B2Jul 29, 2025
Semiconductor device package with stress reduction design
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12362256B2Jul 15, 2025
Method for forming semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12341091B2Jun 24, 2025
Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12334451B2Jun 17, 2025
Semiconductor package including package substrate with dummy via and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12087705B2Sep 10, 2024
Package structure with warpage-control element
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12057363B2Aug 6, 2024
Chip package structure with multiple gap-filling layers and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12040285B2Jul 16, 2024
Structure and formation method of chip package with reinforcing structures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12035475B2Jul 9, 2024
Semiconductor package with stress reduction design and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11984381B2May 14, 2024
Semiconductor package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11894320B2Feb 6, 2024
Semiconductor device package with stress reduction design and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11862549B2Jan 2, 2024
Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11742322B2Aug 29, 2023
Integrated fan-out package having stress release structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11721644B2Aug 8, 2023
Semiconductor package with riveting structure between two rings and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11676916B2Jun 13, 2023
Structure and formation method of package with warpage-control element
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11652037B2May 16, 2023
Semiconductor package and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12550770B2Feb 10, 2026
Embedded stress absorber in package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12538852B2Jan 27, 2026
Package structure containing chip structure with inclined sidewalls
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12394752B2Aug 19, 2025
Multi-chip device and method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12368080B2Jul 22, 2025
Chip package structure with ring structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322666B2Jun 3, 2025
Package assembly lid and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12315768B2May 27, 2025
Package assembly including lid with additional stress mitigating feet and methods of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12266635B2Apr 1, 2025
Semiconductor device package having dummy dies
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12255078B2Mar 18, 2025
Semiconductor devices and methods of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12237276B2Feb 25, 2025
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12176301B2Dec 24, 2024
Package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12125822B2Oct 22, 2024
Method of manufacturing a semiconductor device package having dummy dies
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12113033B2Oct 8, 2024
Chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12014969B2Jun 18, 2024
Package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11978722B2May 7, 2024
Structure and formation method of package containing chip structure with inclined sidewalls
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11955455B2Apr 9, 2024
Embedded stress absorber in package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11854837B2Dec 26, 2023
Semiconductor devices and methods of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11728233B2Aug 15, 2023
Chip package structure with ring structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11728284B2Aug 15, 2023
Chip package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11721643B2Aug 8, 2023
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11705406B2Jul 18, 2023
Package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11532593B2Dec 20, 2022
Embedded stress absorber in package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11990418B2May 21, 2024
Chip package structure with buffer structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12417970B2Sep 16, 2025
Method for forming chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12368127B2Jul 22, 2025
Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewall
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12308346B2May 20, 2025
Semiconductor die with tapered sidewall in package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
Showing the top 50 of 54 patents by PatentIndex Score.