Inventor
LIANG STEVE X
US3 patents
Patents
3 patentsUS7629201B2Dec 8, 2009
Method for fabricating a wafer level package with device wafer and passive component integration
SKYWORKS SOLUTIONS INC27 citations90
US7576426B2Aug 18, 2009
Wafer level package including a device wafer integrated with a passive component
SKYWORKS SOLUTIONS INC31 citations90
US9153551B2Oct 6, 2015
Integrated circuit package including in-situ formed cavity
SKYWORKS SOLUTIONS INC14 citations79