Inventor

BENJAVASUKUL WORAYA

TH5 patents

⚠️ This page may combine multiple inventors who share the name “BENJAVASUKUL WORAYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UTAC HEADQUARTERS PTE LTD

2 patents

US9773722B1Sep 26, 2017

Semiconductor package with partial plating on contact side surfaces

UTAC HEADQUARTERS PTE LTD4 citations71

US10204850B1Feb 12, 2019

Semiconductor package with partial plating on contact side surfaces

UTAC HEADQUARTERS PTE LTD0 citations50

BENJAVASUKUL WORAYA

2 patents

US8569877B2Oct 29, 2013

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

BENJAVASUKUL WORAYA0 citations40

US8431443B2Apr 30, 2013

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

BENJAVASUKUL WORAYA0 citations40

UTAC THAI LTD

1 patent

US8367476B2Feb 5, 2013

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

UTAC THAI LTD11 citations77