P

Inventor

SHIN DONG HWI

KR24 patents
⚠️ This page may combine multiple inventors who share the name “SHIN DONG HWI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

23 patents
US10395840B1Aug 27, 2019

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH27 citations93
US11315732B2Apr 26, 2022

Multi-layer ceramic electronic component

SAMSUNG ELECTRO MECH7 citations84
US10354802B1Jul 16, 2019

Ceramic electronic component

SAMSUNG ELECTRO MECH19 citations83
US10879006B2Dec 29, 2020

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH2 citations73
US10832869B2Nov 10, 2020

Multilayer electronic component

SAMSUNG ELECTRO MECH3 citations73
US10395839B1Aug 27, 2019

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH5 citations72
US11769631B2Sep 26, 2023

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH1 citations71
US11657975B2May 23, 2023

Multi-layer ceramic electronic component

SAMSUNG ELECTRO MECH3 citations71
US11282646B2Mar 22, 2022

Multilayer ceramic electronic component having effective coverage of external electrode

SAMSUNG ELECTRO MECH3 citations71
US11081281B2Aug 3, 2021

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH6 citations71
US11393627B2Jul 19, 2022

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH4 citations68
US11837412B2Dec 5, 2023

Ceramic electronic component

SAMSUNG ELECTRO MECH0 citations62
US11784002B2Oct 10, 2023

Ceramic electronic component

SAMSUNG ELECTRO MECH0 citations62
US11335506B2May 17, 2022

Ceramic electronic component

SAMSUNG ELECTRO MECH0 citations62
US11101074B2Aug 24, 2021

Ceramic electronic component

SAMSUNG ELECTRO MECH0 citations62
US12142433B2Nov 12, 2024

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH0 citations61
US11978594B2May 7, 2024

Multi-layer ceramic electronic component

SAMSUNG ELECTRO MECH0 citations61
US11139114B2Oct 5, 2021

Multilayer capacitor

SAMSUNG ELECTRO MECH1 citations60
US12224121B2Feb 11, 2025

Multilayer capacitor and board having the same mounted thereon

SAMSUNG ELECTRO MECH0 citations59
US11763987B2Sep 19, 2023

Multilayer capacitor and board having the same mounted thereon

SAMSUNG ELECTRO MECH0 citations59
US11527359B2Dec 13, 2022

Multilayer ceramic electronic component and manufacturing method thereof

SAMSUNG ELECTRO MECH0 citations56
US11107633B2Aug 31, 2021

Ceramic electronic component having external electrode including electrode layer and conductive resin layer

SAMSUNG ELECTRO MECH0 citations52
US11664164B2May 30, 2023

Multilayer electronic component

SAMSUNG ELECTRO MECH0 citations50

DAEWON ELECTRIC CO LTD

1 patent