Inventor
MOSELY RODERICK CRAIG
US22 patents
⚠️ This page may combine multiple inventors who share the name “MOSELY RODERICK CRAIG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
20 patentsUS6207222B1Mar 27, 2001
Dual damascene metallization
APPLIED MATERIALS INC120 citations99
US5989623ANov 23, 1999
Dual damascene metallization
APPLIED MATERIALS INC146 citations99
US7049226B2May 23, 2006
Integration of ALD tantalum nitride for copper metallization
APPLIED MATERIALS INC514 citations98
US6139697AOct 31, 2000
Low temperature integrated via and trench fill process and apparatus
APPLIED MATERIALS INC117 citations98
US6107192AAug 22, 2000
Reactive preclean prior to metallization for sub-quarter micron application
APPLIED MATERIALS INC212 citations98
US6001420ADec 14, 1999
Semi-selective chemical vapor deposition
APPLIED MATERIALS INC92 citations98
US6169030B1Jan 2, 2001
Metallization process and method
APPLIED MATERIALS INC57 citations96
US5877087AMar 2, 1999
Low temperature integrated metallization process and apparatus
APPLIED MATERIALS INC69 citations96
US6905965B2Jun 14, 2005
Reactive preclean prior to metallization for sub-quarter micron application
APPLIED MATERIALS INC47 citations95
US6436819B1Aug 20, 2002
Nitrogen treatment of a metal nitride/metal stack
APPLIED MATERIALS INC576 citations95
US6372633B1Apr 16, 2002
Method and apparatus for forming metal interconnects
APPLIED MATERIALS INC58 citations95
US6139905AOct 31, 2000
Integrated CVD/PVD Al planarization using ultra-thin nucleation layers
APPLIED MATERIALS INC24 citations93
US6693030B1Feb 17, 2004
Reactive preclean prior to metallization for sub-quarter micron application
APPLIED MATERIALS INC34 citations92
US6430458B1Aug 6, 2002
Semi-selective chemical vapor deposition
APPLIED MATERIALS INC18 citations92
US6080665AJun 27, 2000
Integrated nitrogen-treated titanium layer to prevent interaction of titanium and aluminum
APPLIED MATERIALS INC39 citations92
US6297147B1Oct 2, 2001
Plasma treatment for ex-situ contact fill
APPLIED MATERIALS INC50 citations91
US6017144AJan 25, 2000
Method and apparatus for depositing highly oriented and reflective crystalline layers using a low temperature seeding layer
APPLIED MATERIALS INC50 citations88
US6726776B1Apr 27, 2004
Low temperature integrated metallization process and apparatus
APPLIED MATERIALS INC9 citations74
US6355560B1Mar 12, 2002
Low temperature integrated metallization process and apparatus
APPLIED MATERIALS INC12 citations74
US6743714B2Jun 1, 2004
Low temperature integrated metallization process and apparatus
APPLIED MATERIALS INC2 citations63