P

Inventor

CLIFTON PAUL A

US58 patents
⚠️ This page may combine multiple inventors who share the name “CLIFTON PAUL A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ACORN TECH INC

22 patents
US7338834B2Mar 4, 2008

Strained silicon with elastic edge relaxation

ACORN TECH INC38 citations96
US7700416B1Apr 20, 2010

Tensile strained semiconductor on insulator using elastic edge relaxation and a sacrificial stressor layer

ACORN TECH INC53 citations94
US9620611B1Apr 11, 2017

MIS contact structure with metal oxide conductor

ACORN TECH INC16 citations93
US9362376B2Jun 7, 2016

Metal contacts to group IV semiconductors by inserting interfacial atomic monolayers

ACORN TECH INC13 citations92
US9270083B2Feb 23, 2016

Tensile strained semiconductor photon emission and detection devices and integrated photonics system

ACORN TECH INC10 citations92
US9036672B2May 19, 2015

Tensile strained semiconductor photon emission and detection devices and integrated photonics system

ACORN TECH INC12 citations92
US7851325B1Dec 14, 2010

Strained semiconductor using elastic edge relaxation, a buried stressor layer and a sacrificial stressor layer

ACORN TECH INC23 citations92
US10505047B2Dec 10, 2019

Nanowire transistor with source and drain induced by electrical contacts with negative Schottky barrier height

ACORN TECH INC5 citations84
US10193307B2Jan 29, 2019

Tensile strained semiconductor photon emission and detection devices and integrated photonics system

ACORN TECH INC4 citations84
US10170627B2Jan 1, 2019

Nanowire transistor with source and drain induced by electrical contacts with negative schottky barrier height

ACORN TECH INC9 citations84
US10147798B2Dec 4, 2018

MIS contact structure with metal oxide conductor

ACORN TECH INC4 citations84
US7972916B1Jul 5, 2011

Method of forming a field effect transistors with a sacrificial stressor layer and strained source and drain regions formed in recesses

ACORN TECH INC14 citations84
US7902029B2Mar 8, 2011

Process for fabricating a self-aligned deposited source/drain insulated gate field-effect transistor

ACORN TECH INC10 citations83
US7816240B2Oct 19, 2010

Method for making semiconductor insulated-gate field-effect transistor having multilayer deposited metal source(s) and/or drain(s)

ACORN TECH INC14 citations83
US10833194B2Nov 10, 2020

SOI wafers and devices with buried stressor

ACORN TECH INC2 citations73
US8361868B2Jan 29, 2013

Transistor with longitudinal strain in channel induced by buried stressor relaxed by implantation

ACORN TECH INC5 citations73
US8361867B2Jan 29, 2013

Biaxial strained field effect transistor devices

ACORN TECH INC3 citations63
US8003486B2Aug 23, 2011

Method of making a semiconductor device having a strained semiconductor active region using edge relaxation, a buried stressor layer and a sacrificial stressor layer

ACORN TECH INC4 citations63
US7612365B2Nov 3, 2009

Strained silicon with elastic edge relaxation

ACORN TECH INC3 citations63
US10727647B2Jul 28, 2020

Tensile strained semiconductor photon emission and detection devices and integrated photonics system

ACORN TECH INC0 citations52
US10580896B2Mar 3, 2020

Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer

ACORN TECH INC0 citations52
US10553695B2Feb 4, 2020

MIS contact structure with metal oxide conductor

ACORN TECH INC0 citations52

ACORN SEMI LLC

19 patents
US11462643B2Oct 4, 2022

Nanowire transistor with source and drain induced by electrical contacts with negative Schottky barrier height

ACORN SEMI LLC3 citations83
US10833199B2Nov 10, 2020

Nanowire transistor with source and drain induced by electrical contacts with negative Schottky barrier height

ACORN SEMI LLC7 citations83
US11843040B2Dec 12, 2023

MIS contact structure with metal oxide conductor

ACORN SEMI LLC1 citations73
US11728624B2Aug 15, 2023

Tensile strained semiconductor photon emission and detection devices and integrated photonics system

ACORN SEMI LLC2 citations73
US10872964B2Dec 22, 2020

MIS contact structure with metal oxide conductor

ACORN SEMI LLC1 citations73
US12557347B2Feb 17, 2026

Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer

ACORN SEMI LLC0 citations62
US12477776B2Nov 18, 2025

Nanowire transistor with source and drain induced by electrical contacts with negative Schottky barrier height

ACORN SEMI LLC0 citations62
US12402365B2Aug 26, 2025

SOI wafers and devices with buried stressors

ACORN SEMI LLC0 citations62
US12336263B2Jun 17, 2025

Metal contacts to group IV semiconductors by inserting interfacial atomic monolayers

ACORN SEMI LLC0 citations62
US12034078B2Jul 9, 2024

Nanowire transistor with source and drain induced by electrical contacts with negative Schottky barrier height

ACORN SEMI LLC0 citations62
US11978800B2May 7, 2024

Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer

ACORN SEMI LLC0 citations62
US11804533B2Oct 31, 2023

Metal contacts to group IV semiconductors by inserting interfacial atomic monolayers

ACORN SEMI LLC0 citations62
US11791411B2Oct 17, 2023

Relating to SOI wafers and devices with buried stressors

ACORN SEMI LLC0 citations62
US11610974B2Mar 21, 2023

Metal contacts to group IV semiconductors by inserting interfacial atomic monolayers

ACORN SEMI LLC0 citations62
US11476364B2Oct 18, 2022

Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer

ACORN SEMI LLC0 citations62
US11322615B2May 3, 2022

SOI wafers and devices with buried stressor

ACORN SEMI LLC0 citations62
US11271370B2Mar 8, 2022

Tensile strained semiconductor photon emission and detection devices and integrated photonics system

ACORN SEMI LLC0 citations62
US10950727B2Mar 16, 2021

Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer

ACORN SEMI LLC0 citations62
US10879366B2Dec 29, 2020

Metal contacts to group IV semiconductors by inserting interfacial atomic monolayers

ACORN SEMI LLC0 citations52

CLIFTON PAUL A

4 patents

GRUPP DANIEL E

1 patent

FAULKNER CARL M

1 patent

GOEBEL ANDREAS

1 patent

ACOM TECHNOLOGIES INC

1 patent

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

1 patent

Showing the top 50 of 58 patents by PatentIndex Score.