Inventor
HOSOKAWA RYUJI
JP8 patents
⚠️ This page may combine multiple inventors who share the name “HOSOKAWA RYUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
7 patentsUS5543658AAug 6, 1996
Method of manufacturing resin-sealed semiconductor device, lead frame used in this method for mounting plurality of semiconductor elements, and resin-sealed semiconductor device
TOSHIBA KK51 citations93
US6734541B2May 11, 2004
Semiconductor laminated module
TOSHIBA KK26 citations90
US5614441AMar 25, 1997
Process of folding a strip leadframe to superpose two leadframes in a plural semiconductor die encapsulated package
TOSHIBA KK39 citations89
US7202563B2Apr 10, 2007
Semiconductor device package having a semiconductor element with resin
TOSHIBA KK7 citations73
US7405159B2Jul 29, 2008
Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface
TOSHIBA KK3 citations62
US7298035B2Nov 20, 2007
Semiconductor device and a method of assembling a semiconductor device
TOSHIBA KK3 citations61
US7608911B2Oct 27, 2009
Semiconductor device package having a semiconductor element with a roughened surface
TOSHIBA KK0 citations51