Inventor

PIECH GARRETT ANDREW

US61 patents

⚠️ This page may combine multiple inventors who share the name “PIECH GARRETT ANDREW”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PIECH GARRETT ANDREW

CORNING INC

Processing 3D shaped transparent brittle substrate

Laser cutting of display glass compositions

Method for rapid laser drilling of holes in glass and products made therefrom

Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots

Method for rapid laser drilling of holes in glass and products made therefrom

Sacrificial cover layers for laser drilling substrates and methods thereof

Laser processing of sapphire substrate and related applications

Edge chamfering methods

Laser processing of sapphire substrate and related applications

Connecting structures comprising heated flexures and optical packages incorporating the same

Multi-variable control methods for optical packages

Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots

Method for rapid laser drilling of holes in glass and products made therefrom

Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same

Edge chamfering methods

Systems and methods for processing transparent materials using adjustable laser beam focal lines

Methods and system for aligning optical packages

Laser cut composite glass article and method of cutting

Method and system for arresting crack propagation

Laser cut composite glass article and method of cutting

Laser cut composite glass article and method of cutting

Transparent material cutting with ultrafast laser and beam optics

Methods for laser processing a substrate stack having one or more transparent workpieces and a black matrix layer

Work piece including a sacrificial cover layer for laser drilling substrates

Laser processing of slots and holes

Optical packages and methods for aligning optical packages

Tiled displays and methods of manufacturing the same

Method for rapid laser drilling of holes in glass and products made therefrom

Laser cutting and removal of contoured shapes from transparent substrates

Inorganic wafer having through-holes attached to semiconductor wafer

Display devices having an antiglare layer providing reduced sparkle appearance

Laser cutting and processing of display glass compositions

Systems and methods for reducing substrate surface disruption during via formation

Laser cutting of thermally tempered substrates

Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same

Articles having holes with morphology attributes and methods for fabricating the same

Laser cutting of materials with intensity mapping optical system

Wavelength conversion devices and fabrication methods for same

Methods for forming holes in substrates

Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same

Electrochromic coated glass articles and methods for laser processing the same

Methods for laser processing transparent workpieces using pulsed laser beam focal lines and vapor etching

Sacrificial layers to enable laser cutting of textured substrates

Processing 3D shaped transparent brittle substrate

Apparatus and method for inspecting laser defect inside of transparent material

Corning Optical Communications LLC

Ferrule-core concentricity measurement systems and methods

Ferrule-core concentricity measurement systems and methods

Methods of forming ferrules for optical fiber connectors, and optical fiber cable assemblies related to such methods

Methods of ferrule reshaping for correcting core-to-ferrule concentricity errors, and optical fiber cable assemblies related to such methods

GOLLIER JACQUES

Apparatus and method for determining sparkle