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Inventor
FU SHENG-HSIANG
TW
4 patents
⚠️ This page may combine multiple inventors who share the name “FU SHENG-HSIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XINTEC INC
2 patents
US12598974B2
Apr 7, 2026
Chip package and manufacturing method thereof
XINTEC INC
0 citations
53
US12424567B2
Sep 23, 2025
Chip package and manufacturing method thereof
XINTEC INC
0 citations
45
LIN CHAO-YEN
2 patents
US8502393B2
Aug 6, 2013
Chip package and method for forming the same
LIN CHAO-YEN
0 citations
42
US8294275B2
Oct 23, 2012
Chip package and method for forming the same
LIN CHAO-YEN
0 citations
42