Inventor

LU TSAI-HUA

TW2 patents

⚠️ This page may combine multiple inventors who share the name “LU TSAI-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITIVE ELECTRONICS INC

1 patent

US7081404B2Jul 25, 2006

Methods of selectively bumping integrated circuit substrates and related structures

UNITIVE ELECTRONICS INC56 citations92

UNITIVE INT LTD

1 patent

US7579694B2Aug 25, 2009

Electronic devices including offset conductive bumps

UNITIVE INT LTD19 citations89