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Inventor
LIN I-CHING
TW
5 patents
⚠️ This page may combine multiple inventors who share the name “LIN I-CHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHEN MING-FA
2 patents
US8222139B2
Jul 17, 2012
Chemical mechanical polishing (CMP) processing of through-silicon via (TSV) and contact plug simultaneously
CHEN MING-FA
9 citations
82
US8546886B2
Oct 1, 2013
Controlling the device performance by forming a stressed backside dielectric layer
CHEN MING-FA
2 citations
60
TAIWAN SEMICONDUCTOR MFG
2 patents
US9236311B2
Jan 12, 2016
Controlling the device performance by forming a stressed backside dielectric layer
TAIWAN SEMICONDUCTOR MFG
1 citations
60
US8946084B2
Feb 3, 2015
Controlling the device performance by forming a stressed backside dielectric layer
TAIWAN SEMICONDUCTOR MFG
0 citations
50
HUANG TSUNG-CHENG
1 patent
US8084361B2
Dec 27, 2011
Semiconductor fabrication method suitable for MEMS
HUANG TSUNG-CHENG
2 citations
50