Inventor

HARUNA YUUSUKE

JP10 patents

Patents

10 patents

US10638598B2Apr 28, 2020

Ground member, shielded printed circuit board, and method for manufacturing shielded printed circuit board

TATSUTA ELECTRIC WIRE & CABLE CO LTD5 citations70

US11758705B2Sep 12, 2023

Electromagnetic wave shielding film

TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations59

US11653439B2May 16, 2023

Ground member and shielded printed wiring board

TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations59

US11597858B1Mar 7, 2023

Conductive adhesive

TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations58

US11457527B2Sep 27, 2022

Shield printed wiring board and method of manufacturing shield printed wiring board

TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations54

US12526924B2Jan 13, 2026

Conductive adhesive sheet

TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations49

US12150239B2Nov 19, 2024

Method for manufacturing shielded printed wiring board and shielded printed wiring board

TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations48

US12101872B2Sep 24, 2024

Shield printed wiring board with ground member and ground member

TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations48

US12028964B2Jul 2, 2024

Shielded printed wiring board, method for manufacturing shielded printed wiring board, and connecting member

TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations48

US10159142B2Dec 18, 2018

Printed wiring board with a reinforcing member having a diffusion-bonded nickel layer

TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations47