Inventor
LEE EUI RANG
KR4 patents
Patents
4 patentsUS12552962B2Feb 17, 2026
CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
SAMSUNG SDI CO LTD0 citations56
US11560495B2Jan 24, 2023
CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
SAMSUNG SDI CO LTD0 citations48
US12516220B2Jan 6, 2026
CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
SAMSUNG SDI CO LTD0 citations46
US12139642B2Nov 12, 2024
CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
SAMSUNG SDI CO LTD0 citations46