Inventor
YOUN CHEUL-JOONG
KR4 patents
Patents
4 patentsUS8053881B2Nov 8, 2011
Semiconductor package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD10 citations82
US6984877B2Jan 10, 2006
Bumped chip carrier package using lead frame and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD14 citations79
US7495315B2Feb 24, 2009
Method and apparatus of fabricating a semiconductor device by back grinding and dicing
SAMSUNG ELECTRONICS CO LTD5 citations71
US7323397B2Jan 29, 2008
Method and apparatus of fabricating a semiconductor device by back grinding and dicing
SAMSUNG ELECTRONICS CO LTD3 citations60