Inventor
HENDERSON BRIAN M
US11 patents
⚠️ This page may combine multiple inventors who share the name “HENDERSON BRIAN M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
5 patentsUS8362599B2Jan 29, 2013
Forming radio frequency integrated circuits
QUALCOMM INC26 citations89
US9184130B2Nov 10, 2015
Electrostatic protection for stacked multi-chip integrated circuits
QUALCOMM INC6 citations72
US9153461B2Oct 6, 2015
Semiconductor device having stacked memory elements and method of stacking memory elements on a semiconductor device
QUALCOMM INC4 citations72
US9041220B2May 26, 2015
Semiconductor device having stacked memory elements and method of stacking memory elements on a semiconductor device
QUALCOMM INC3 citations62
US9093462B2Jul 28, 2015
Electrostatic discharge diode
QUALCOMM INC1 citations52
HENDERSON BRIAN M
3 patentsUS8319325B2Nov 27, 2012
Intra-die routing using back side redistribution layer and associated method
HENDERSON BRIAN M6 citations62
US8198736B2Jun 12, 2012
Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assembly
HENDERSON BRIAN M2 citations60
US8604626B2Dec 10, 2013
Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assembly
HENDERSON BRIAN M0 citations47