Inventor
NAGOYA TOMOHIRO
JP9 patents
⚠️ This page may combine multiple inventors who share the name “NAGOYA TOMOHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
5 patentsUS6849385B2Feb 1, 2005
Photosensitive resin composition, process of forming patterns with the same, and electronic components
HITACHI CHEMICAL CO LTD10 citations72
US11908762B2Feb 20, 2024
Temporary protective film for semiconductor sealing molding, lead frame with temporary protective film, sealed molded body with temporary protective film, and method for producing semiconductor device
HITACHI CHEMICAL CO LTD0 citations60
US11251055B2Feb 15, 2022
Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device
HITACHI CHEMICAL CO LTD1 citations60
US11195728B2Dec 7, 2021
Temporary protective film for semiconductor sealing molding
HITACHI CHEMICAL CO LTD0 citations59
US7843045B2Nov 30, 2010
Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device
HITACHI CHEMICAL CO LTD5 citations57
SHOWA DENKO MATERIALS CO LTD
2 patentsUS11682564B2Jun 20, 2023
Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device
SHOWA DENKO MATERIALS CO LTD0 citations60
US12451367B2Oct 21, 2025
Temporary protective film for semiconductor encapsulation molding, lead frame with temporary protective film, encapsulation molded body with temporary protective film, and method for manufacturing semiconductor device
SHOWA DENKO MATERIALS CO LTD0 citations48
RESONAC CORP
2 patentsUS12435248B2Oct 7, 2025
Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulation molded body, and method for manufacturing semiconductor package
RESONAC CORP0 citations50
US12398298B2Aug 26, 2025
Temporary protective film for producing semiconductor device, reel body, and method for producing semiconductor device
RESONAC CORP0 citations50