Inventor
WANG DONGDONG
CN97 patents
⚠️ This page may combine multiple inventors who share the name “WANG DONGDONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBIDEN CO LTD
28 patentsUS7435910B2Oct 14, 2008
Multilayer printed circuit board
IBIDEN CO LTD63 citations99
US7342803B2Mar 11, 2008
Printed circuit board and method of manufacturing printed circuit board
IBIDEN CO LTD92 citations99
US7307852B2Dec 11, 2007
Printed circuit board and method for manufacturing printed circuit board
IBIDEN CO LTD82 citations99
US6909054B2Jun 21, 2005
Multilayer printed wiring board and method for producing multilayer printed wiring board
IBIDEN CO LTD131 citations99
US6876554B1Apr 5, 2005
Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board
IBIDEN CO LTD160 citations99
US6828510B1Dec 7, 2004
Multilayer printed wiring board and method of manufacturing multilayer printed wiring board
IBIDEN CO LTD176 citations99
US6724638B1Apr 20, 2004
Printed wiring board and method of producing the same
IBIDEN CO LTD249 citations99
US7978478B2Jul 12, 2011
Printed circuit board
IBIDEN CO LTD46 citations98
US7852634B2Dec 14, 2010
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
IBIDEN CO LTD55 citations98
US7535095B1May 19, 2009
Printed wiring board and method for producing the same
IBIDEN CO LTD59 citations97
US7985930B2Jul 26, 2011
Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
IBIDEN CO LTD30 citations96
US7855894B2Dec 21, 2010
Printed circuit board
IBIDEN CO LTD26 citations96
US7855342B2Dec 21, 2010
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
IBIDEN CO LTD29 citations96
US7842887B2Nov 30, 2010
Multilayer printed circuit board
IBIDEN CO LTD45 citations96
US7504719B2Mar 17, 2009
Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same
IBIDEN CO LTD33 citations96
US7893360B2Feb 22, 2011
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
IBIDEN CO LTD18 citations93
US7888606B2Feb 15, 2011
Multilayer printed circuit board
IBIDEN CO LTD14 citations93
US8030577B2Oct 4, 2011
Printed wiring board and method for producing the same
IBIDEN CO LTD9 citations92
US8020291B2Sep 20, 2011
Method of manufacturing a printed wiring board
IBIDEN CO LTD13 citations92
US8018045B2Sep 13, 2011
Printed circuit board
IBIDEN CO LTD18 citations92
US8006377B2Aug 30, 2011
Method for producing a printed wiring board
IBIDEN CO LTD9 citations92
US7995352B2Aug 9, 2011
Printed circuit board
IBIDEN CO LTD11 citations92
US7916492B1Mar 29, 2011
Multilayered printed circuit board
IBIDEN CO LTD25 citations92
US7881069B2Feb 1, 2011
Printed circuit board
IBIDEN CO LTD13 citations92
US7864543B2Jan 4, 2011
Printed circuit board
IBIDEN CO LTD9 citations92
US7864542B2Jan 4, 2011
Printed circuit board
IBIDEN CO LTD21 citations92
US9245838B2Jan 26, 2016
Semiconductor element
IBIDEN CO LTD3 citations84
US7910836B2Mar 22, 2011
Multilayered printed circuit board, solder resist composition, and semiconductor device
IBIDEN CO LTD8 citations84
SAKAMOTO HAJIME
7 patentsUS8453323B2Jun 4, 2013
Printed circuit board manufacturing method
SAKAMOTO HAJIME12 citations92
US8186045B2May 29, 2012
Multilayer printed circuit board and multilayer printed circuit board manufacturing method
SAKAMOTO HAJIME14 citations92
US8079142B2Dec 20, 2011
Printed circuit board manufacturing method
SAKAMOTO HAJIME15 citations92
US8067699B2Nov 29, 2011
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
SAKAMOTO HAJIME8 citations92
US8959756B2Feb 24, 2015
Method of manufacturing a printed circuit board having an embedded electronic component
SAKAMOTO HAJIME6 citations84
US8822323B2Sep 2, 2014
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
SAKAMOTO HAJIME6 citations84
US8524535B2Sep 3, 2013
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
SAKAMOTO HAJIME6 citations84
INAGAKI YASUSHI
5 patentsUS8830691B2Sep 9, 2014
Printed circuit board and method of manufacturing printed circuit board
INAGAKI YASUSHI12 citations92
US8331102B2Dec 11, 2012
Printed circuit board
INAGAKI YASUSHI14 citations92
US8107253B2Jan 31, 2012
Printed circuit board
INAGAKI YASUSHI9 citations92
US8780573B2Jul 15, 2014
Printed circuit board
INAGAKI YASUSHI6 citations84
US8116091B2Feb 14, 2012
Printed circuit board
INAGAKI YASUSHI7 citations84
ASAI MOTOO
5 patentsUS8745863B2Jun 10, 2014
Method of manufacturing multi-layer printed circuit board
ASAI MOTOO6 citations84
US8288664B2Oct 16, 2012
Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board
ASAI MOTOO7 citations84
US8288665B2Oct 16, 2012
Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
ASAI MOTOO7 citations84
US8283573B2Oct 9, 2012
Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board
ASAI MOTOO7 citations84
US8822828B2Sep 2, 2014
Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
ASAI MOTOO3 citations74
INTEL CORP
1 patentPANASONIC IP MAN CO LTD
1 patentHONEYWELL INT INC
1 patentGOOGLE LLC
1 patentWANG DONGDONG
1 patentShowing the top 50 of 97 patents by PatentIndex Score.