Inventor

LOBIANCO ANTHONY J

US4 patents

⚠️ This page may combine multiple inventors who share the name “LOBIANCO ANTHONY J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AMKOR TECHNOLOGY INC

2 patents

US6340846B1Jan 22, 2002

Making semiconductor packages with stacked dies and reinforced wire bonds

AMKOR TECHNOLOGY INC269 citations97

US6534338B1Mar 18, 2003

Method for molding semiconductor package having a ceramic substrate

AMKOR TECHNOLOGY INC26 citations90

SKYWORKS SOLUTIONS INC

2 patents

US7629201B2Dec 8, 2009

Method for fabricating a wafer level package with device wafer and passive component integration

SKYWORKS SOLUTIONS INC27 citations90

US7576426B2Aug 18, 2009

Wafer level package including a device wafer integrated with a passive component

SKYWORKS SOLUTIONS INC31 citations90