Inventor
CHAN SOOK WOON
MY7 patents
Patents
7 patentsUS9475691B1Oct 25, 2016
Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device
INFINEON TECHNOLOGIES AG14 citations80
US10396007B2Aug 27, 2019
Semiconductor package with plateable encapsulant and a method for manufacturing the same
INFINEON TECHNOLOGIES AG4 citations71
US11174152B2Nov 16, 2021
Over-under sensor packaging with sensor spaced apart from control chip
INFINEON TECHNOLOGIES AG0 citations61
US11081417B2Aug 3, 2021
Manufacturing a package using plateable encapsulant
INFINEON TECHNOLOGIES AG1 citations60
US11682644B2Jun 20, 2023
Semiconductor device with a heterogeneous solder joint and method for fabricating the same
INFINEON TECHNOLOGIES AG0 citations58
US10501312B2Dec 10, 2019
Over-under sensor packaging with sensor spaced apart from control chip
INFINEON TECHNOLOGIES AG0 citations50
US10490470B2Nov 26, 2019
Semiconductor package and method for fabricating a semiconductor package
INFINEON TECHNOLOGIES AG0 citations42