Inventor
LUM FONG MEI
MY4 patents
Patents
4 patentsUS10431560B2Oct 1, 2019
Molded semiconductor package having an optical inspection feature
INFINEON TECHNOLOGIES AG2 citations67
US9806043B2Oct 31, 2017
Method of manufacturing molded semiconductor packages having an optical inspection feature
INFINEON TECHNOLOGIES AG2 citations67
US11682644B2Jun 20, 2023
Semiconductor device with a heterogeneous solder joint and method for fabricating the same
INFINEON TECHNOLOGIES AG0 citations58
US12550751B2Feb 10, 2026
Flip chip bonding for semiconductor packages using metal strip
INFINEON TECHNOLOGIES AG0 citations41