Inventor

ATADANA FREDERICK W

US3 patents

Patents

3 patents

US11935861B2Mar 19, 2024

Underfill flow management in electronic assemblies

INTEL CORP0 citations57

US11935799B2Mar 19, 2024

Integrated circuit package lids with polymer features

INTEL CORP0 citations54

US11710672B2Jul 25, 2023

Microelectronic package with underfilled sealant

INTEL CORP0 citations54