Inventor

RYU HWANG-BOK

KR2 patents

⚠️ This page may combine multiple inventors who share the name “RYU HWANG-BOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

1 patent

US8053351B2Nov 8, 2011

Method of forming at least one bonding structure

SAMSUNG ELECTRONICS CO LTD2 citations58

KIM GOON WOO

1 patent

US8156636B2Apr 17, 2012

Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatus

KIM GOON WOO2 citations48