Inventor

LEE CHING-KUAN

TW2 patents

Patents

2 patents

US9941226B2Apr 10, 2018

Integrated millimeter-wave chip package

IND TECH RES INST5 citations69

US12027470B2Jul 2, 2024

Package carrier having a stiffener between solder bumps

IND TECH RES INST1 citations58