P

Inventor

WU WEI-JEN

TW10 patents
⚠️ This page may combine multiple inventors who share the name “WU WEI-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

3 patents
US9530871B1Dec 27, 2016

Method for fabricating a semiconductor device

UNITED MICROELECTRONICS CORP9 citations82
US9443757B1Sep 13, 2016

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP12 citations82
US9673053B2Jun 6, 2017

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP1 citations51

TAIWAN SEMICONDUCTOR MFG CO LTD

3 patents
US11908843B2Feb 20, 2024

Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations68
US12406970B2Sep 2, 2025

Semiconductor package and method of bonding workpieces

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12381191B2Aug 5, 2025

Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58

TAIWAN SEMICONDUCTOR MFG

2 patents
US6811955B2Nov 2, 2004

Method for photoresist development with improved CD

TAIWAN SEMICONDUCTOR MFG8 citations69
US7172948B2Feb 6, 2007

Method to avoid a laser marked area step height

TAIWAN SEMICONDUCTOR MFG5 citations59

UNICTRON TECH CORPORATION

1 patent
US12337348B2Jun 24, 2025

Ultrasonic transducer

UNICTRON TECH CORPORATION0 citations53

UNIV NAT CENTRAL

1 patent
US10414088B2Sep 17, 2019

Platform structure for use in low-temperature manufacturing of scaffold for use in tissue engineering and method of low-temperature manufacturing scaffold for use in tissue engineering

UNIV NAT CENTRAL0 citations34