Inventor
SHIBUYA MAKOTO
JP64 patents
⚠️ This page may combine multiple inventors who share the name “SHIBUYA MAKOTO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
24 patentsUS9620440B1Apr 11, 2017
Power module packaging with dual side cooling
TEXAS INSTRUMENTS INC21 citations94
US12230539B2Feb 18, 2025
Wafer chip scale packaging with ball attach before repassivation
TEXAS INSTRUMENTS INC4 citations75
US11088055B2Aug 10, 2021
Package with dies mounted on opposing surfaces of a leadframe
TEXAS INSTRUMENTS INC4 citations73
US11062980B2Jul 13, 2021
Integrated circuit packages with wettable flanks and methods of manufacturing the same
TEXAS INSTRUMENTS INC4 citations73
US10541220B1Jan 21, 2020
Printed repassivation for wafer chip scale packaging
TEXAS INSTRUMENTS INC4 citations73
US11387179B2Jul 12, 2022
IC package with half-bridge power module
TEXAS INSTRUMENTS INC2 citations72
US12119263B2Oct 15, 2024
Methods and apparatus for an improved integrated circuit package
TEXAS INSTRUMENTS INC0 citations63
US11842952B2Dec 12, 2023
Double side heat dissipation for silicon chip package
TEXAS INSTRUMENTS INC0 citations63
US11764142B2Sep 19, 2023
Semiconductor apparatus and method having a lead frame with floating leads
TEXAS INSTRUMENTS INC0 citations63
US11217522B2Jan 4, 2022
Semiconductor apparatus and method having a lead frame with floating leads
TEXAS INSTRUMENTS INC0 citations63
US11004742B2May 11, 2021
Methods and apparatus for an improved integrated circuit package
TEXAS INSTRUMENTS INC0 citations63
US10566269B2Feb 18, 2020
Low stress integrated circuit package
TEXAS INSTRUMENTS INC1 citations63
US12272626B2Apr 8, 2025
Conductive members atop semiconductor packages
TEXAS INSTRUMENTS INC0 citations62
US12046542B2Jul 23, 2024
Heat-dissipating wirebonded members on package surfaces
TEXAS INSTRUMENTS INC0 citations62
US11942384B2Mar 26, 2024
Semiconductor package having an interdigitated mold arrangement
TEXAS INSTRUMENTS INC0 citations62
US11848244B2Dec 19, 2023
Leaded wafer chip scale packages
TEXAS INSTRUMENTS INC0 citations62
US11574855B2Feb 7, 2023
Package with dies mounted on opposing surfaces of a leadframe
TEXAS INSTRUMENTS INC0 citations62
US11217513B2Jan 4, 2022
Integrated circuit package with pre-wetted contact sidewall surfaces
TEXAS INSTRUMENTS INC0 citations62
US12040260B2Jul 16, 2024
Electronic package with surface contact wire extensions
TEXAS INSTRUMENTS INC0 citations61
US11955456B2Apr 9, 2024
Flip chip packaged devices with thermal pad
TEXAS INSTRUMENTS INC0 citations55
US12581980B2Mar 17, 2026
IC package with field effect transistor
TEXAS INSTRUMENTS INC0 citations52
US12532786B2Jan 20, 2026
Semiconductor device package with vertically stacked passive component
TEXAS INSTRUMENTS INC0 citations52
US12456707B2Oct 28, 2025
Stacked clip design for GaN half bridge IPM
TEXAS INSTRUMENTS INC0 citations52
US10636729B2Apr 28, 2020
Integrated circuit package with pre-wetted contact sidewall surfaces
TEXAS INSTRUMENTS INC0 citations52
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
7 patentsUS6137095AOct 24, 2000
Cooking device with system for controlling cooking of foods
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD91 citations98
US6274859B1Aug 14, 2001
High frequency heating apparatus for selective heating of a desired portion of an object
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD90 citations97
US5986249ANov 16, 1999
High frequency heating apparatus for providing a uniform heating of an object
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD81 citations96
US6172348B1Jan 9, 2001
High frequency heating apparatus
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD77 citations95
US6371925B1Apr 16, 2002
Radiation clinical thermometer
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD113 citations91
US5250775AOct 5, 1993
Electric cooking apparatus adapted for generating high power output containing a battery
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD39 citations91
US5288961AFeb 22, 1994
High frequency heating apparatus utilizing an inverter power supply
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD20 citations90
SAMSUNG ELECTRONICS CO LTD
5 patentsUS10132555B2Nov 20, 2018
Refrigerator
SAMSUNG ELECTRONICS CO LTD8 citations83
US11656021B2May 23, 2023
Refrigerator
SAMSUNG ELECTRONICS CO LTD3 citations71
US10935300B2Mar 2, 2021
Refrigerator including a detachably mounted cooling unit
SAMSUNG ELECTRONICS CO LTD2 citations66
US12535262B2Jan 27, 2026
Refrigerator
SAMSUNG ELECTRONICS CO LTD0 citations60
US11725864B2Aug 15, 2023
Refrigerator
SAMSUNG ELECTRONICS CO LTD0 citations60
SHIBUYA MAKOTO
4 patentsUS8593099B2Nov 26, 2013
Electric compressor
SHIBUYA MAKOTO9 citations83
US8282695B2Oct 9, 2012
Air conditioner
SHIBUYA MAKOTO8 citations83
US8631664B2Jan 21, 2014
Air conditioner with automatic air filter cleaner
SHIBUYA MAKOTO12 citations82
US8305027B2Nov 6, 2012
Electric compressor control device
SHIBUYA MAKOTO2 citations62
SANDEN CORP
3 patentsUS6564576B2May 20, 2003
Motor-driven compressors
SANDEN CORP32 citations93
US6710564B2Mar 23, 2004
Methods and apparatus for controlling brushless motors
SANDEN CORP31 citations86
US7352598B2Apr 1, 2008
Inverter units with duty cycle control based on the detected, high and low output voltage
SANDEN CORP6 citations63
FUJI HEAVY IND LTD
1 patentSAITO ATSUSHI
1 patentROHM CO LTD
1 patentFUJITSU GENERAL LTD
1 patentSUGIYAMA SHINJI
1 patentTS TECH CO LTD
1 patentJUSTSYSTEM CORP
1 patentShowing the top 50 of 64 patents by PatentIndex Score.