P

Inventor

SHIBUYA MAKOTO

JP64 patents
⚠️ This page may combine multiple inventors who share the name “SHIBUYA MAKOTO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TEXAS INSTRUMENTS INC

24 patents
US9620440B1Apr 11, 2017

Power module packaging with dual side cooling

TEXAS INSTRUMENTS INC21 citations94
US12230539B2Feb 18, 2025

Wafer chip scale packaging with ball attach before repassivation

TEXAS INSTRUMENTS INC4 citations75
US11088055B2Aug 10, 2021

Package with dies mounted on opposing surfaces of a leadframe

TEXAS INSTRUMENTS INC4 citations73
US11062980B2Jul 13, 2021

Integrated circuit packages with wettable flanks and methods of manufacturing the same

TEXAS INSTRUMENTS INC4 citations73
US10541220B1Jan 21, 2020

Printed repassivation for wafer chip scale packaging

TEXAS INSTRUMENTS INC4 citations73
US11387179B2Jul 12, 2022

IC package with half-bridge power module

TEXAS INSTRUMENTS INC2 citations72
US12119263B2Oct 15, 2024

Methods and apparatus for an improved integrated circuit package

TEXAS INSTRUMENTS INC0 citations63
US11842952B2Dec 12, 2023

Double side heat dissipation for silicon chip package

TEXAS INSTRUMENTS INC0 citations63
US11764142B2Sep 19, 2023

Semiconductor apparatus and method having a lead frame with floating leads

TEXAS INSTRUMENTS INC0 citations63
US11217522B2Jan 4, 2022

Semiconductor apparatus and method having a lead frame with floating leads

TEXAS INSTRUMENTS INC0 citations63
US11004742B2May 11, 2021

Methods and apparatus for an improved integrated circuit package

TEXAS INSTRUMENTS INC0 citations63
US10566269B2Feb 18, 2020

Low stress integrated circuit package

TEXAS INSTRUMENTS INC1 citations63
US12272626B2Apr 8, 2025

Conductive members atop semiconductor packages

TEXAS INSTRUMENTS INC0 citations62
US12046542B2Jul 23, 2024

Heat-dissipating wirebonded members on package surfaces

TEXAS INSTRUMENTS INC0 citations62
US11942384B2Mar 26, 2024

Semiconductor package having an interdigitated mold arrangement

TEXAS INSTRUMENTS INC0 citations62
US11848244B2Dec 19, 2023

Leaded wafer chip scale packages

TEXAS INSTRUMENTS INC0 citations62
US11574855B2Feb 7, 2023

Package with dies mounted on opposing surfaces of a leadframe

TEXAS INSTRUMENTS INC0 citations62
US11217513B2Jan 4, 2022

Integrated circuit package with pre-wetted contact sidewall surfaces

TEXAS INSTRUMENTS INC0 citations62
US12040260B2Jul 16, 2024

Electronic package with surface contact wire extensions

TEXAS INSTRUMENTS INC0 citations61
US11955456B2Apr 9, 2024

Flip chip packaged devices with thermal pad

TEXAS INSTRUMENTS INC0 citations55
US12581980B2Mar 17, 2026

IC package with field effect transistor

TEXAS INSTRUMENTS INC0 citations52
US12532786B2Jan 20, 2026

Semiconductor device package with vertically stacked passive component

TEXAS INSTRUMENTS INC0 citations52
US12456707B2Oct 28, 2025

Stacked clip design for GaN half bridge IPM

TEXAS INSTRUMENTS INC0 citations52
US10636729B2Apr 28, 2020

Integrated circuit package with pre-wetted contact sidewall surfaces

TEXAS INSTRUMENTS INC0 citations52

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

7 patents

SAMSUNG ELECTRONICS CO LTD

5 patents

SHIBUYA MAKOTO

4 patents

SANDEN CORP

3 patents

FUJI HEAVY IND LTD

1 patent

SAITO ATSUSHI

1 patent

ROHM CO LTD

1 patent

FUJITSU GENERAL LTD

1 patent

SUGIYAMA SHINJI

1 patent

TS TECH CO LTD

1 patent

JUSTSYSTEM CORP

1 patent

Showing the top 50 of 64 patents by PatentIndex Score.