Inventor

KAO CHENG-HENG

TW6 patents

⚠️ This page may combine multiple inventors who share the name “KAO CHENG-HENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNIV NAT CENTRAL

3 patents

US6744142B2Jun 1, 2004

Flip chip interconnection structure and process of making the same

UNIV NAT CENTRAL27 citations91

US6642079B1Nov 4, 2003

Process of fabricating flip chip interconnection structure

UNIV NAT CENTRAL50 citations91

US6602777B1Aug 5, 2003

Method for controlling the formation of intermetallic compounds in solder joints

UNIV NAT CENTRAL26 citations89

UNIV NAT TAIWAN

2 patents

US10332861B2Jun 25, 2019

Interconnection structures and methods for making the same

UNIV NAT TAIWAN2 citations70

US9786634B2Oct 10, 2017

Interconnection structures and methods for making the same

UNIV NAT TAIWAN0 citations49

TAIWAN SEMICONDUCTOR MFG CO LTD

1 patent

US9666441B2May 30, 2017

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48