Inventor

SWAN LANCE

US2 patents

⚠️ This page may combine multiple inventors who share the name “SWAN LANCE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NSCRYPT INC

1 patent

US7972650B1Jul 5, 2011

Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections

NSCRYPT INC31 citations87

CHURCH KENNETH H

1 patent

US8790742B2Jul 29, 2014

Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections

CHURCH KENNETH H1 citations45