Inventor · disambiguated record
Bernd Roelfs
Also filed as: ROELFS BERND
6 granted patents·1 pending application·48 citations·filing 2005–2016
80Inventor score
Top patents by PatentIndex Score
7 records- 0191US8679316B2Aqueous, acid bath and method for the electrolytic deposition of copperBRUNNER HEIKO·Filed 2009·Granted Mar 25, 2014·23 cites·18 claims
- 0279US9551080B2Copper plating bath compositionATOTECH DEUTSCHLAND GMBH·Filed 2013·Granted Jan 24, 2017·8 cites·16 claims
- 0379US9506158B2Method for copper platingROHDE DIRK·Filed 2012·Granted Nov 29, 2016·10 cites·20 claims
- 0478US8784634B2Electrolytic method for filling holes and cavities with metalsREENTS BERT·Filed 2007·Granted Jul 22, 2014·5 cites·25 claims
- 0572US9445510B2Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copperREENTS BERT·Filed 2005·Granted Sep 13, 2016·2 cites·22 claims
- 0648US2015014177A1Method for producing matt copper depositsATOTECH DEUTSCHLAND GMBH·Filed 2012·Application pending·0 cites
- 0747US9526183B2Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copperATOTECH DEUTSCHLAND GMBH·Filed 2016·Granted Dec 20, 2016·0 cites·20 claims
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