Inventor

LIN PUI-YAN

US18 patents

⚠️ This page may combine multiple inventors who share the name “LIN PUI-YAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN PUI-YAN

DU PONT

High shear modulus aramid honeycomb

Low loss dielectric material for printed circuit boards and integrated circuit chip packaging

Apparatus for applying adhesive to a honeycomb half-cell structure

Printed circuits prepared from filled epoxy compositions

System and method for advancing the leading edge of a corrugated web

Filled epoxy compositions

Apparatus and process for stacking sheets of half-cell structure to make a honeycomb core

Process for making a honeycomb core from a honeycomb half-cell structure and honeycomb core made thereby

Polyamic acid cross-linked polymer and formable composition therefrom

Polyimide cross-linked polymer and shaped article thereof

Apparatus and process for cutting a honeycomb half-cell structure into sheets

Transfer head for holding half-cell structure

Graft oligomeric electrolytes

LIN PUI-YAN

Composite of a polymer and surface modified hexagonal boron nitride particles

Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles

Multi-layer chip carrier and process for making

Multi-layer chip carrier and process for making

Method for preparing consolidated multi-layer article using curable epoxy composition with quaternary ammonium bicarbonate curing catalyst