Inventor
TOMIYOSHI KAZUTOSHI
JP48 patents
⚠️ This page may combine multiple inventors who share the name “TOMIYOSHI KAZUTOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU CHEMICAL CO
42 patentsUS5940688AAug 17, 1999
Epoxy resin composition and semiconductor device encapsulated therewith
SHINETSU CHEMICAL CO57 citations96
US4902732AFeb 20, 1990
Epoxy resin-based curable compositions
SHINETSU CHEMICAL CO60 citations94
US5418266AMay 23, 1995
Epoxy resin compositions and semiconductor devices encapsulated therewith
SHINETSU CHEMICAL CO24 citations93
US5358980AOct 25, 1994
Naphthol novolac epoxy resin compositions and semiconductor devices encapsulated therewith
SHINETSU CHEMICAL CO25 citations93
US5298548AMar 29, 1994
Epoxy resin composition and semiconductor devices encapsulated therewith
SHINETSU CHEMICAL CO33 citations93
US4877822AOct 31, 1989
Epoxy resin composition
SHINETSU CHEMICAL CO42 citations93
US4859722AAug 22, 1989
Epoxy resin composition
SHINETSU CHEMICAL CO34 citations93
US4701482AOct 20, 1987
Epoxy resin composition for encapsulation of semiconductor devices
SHINETSU CHEMICAL CO28 citations93
US6630745B1Oct 7, 2003
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO18 citations92
US6177489B1Jan 23, 2001
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO53 citations92
US6162878ADec 19, 2000
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO21 citations92
US6001901ADec 14, 1999
Epoxy resin composition
SHINETSU CHEMICAL CO28 citations92
US5137940AAug 11, 1992
Semiconductor encapsulating epoxy resin compositions
SHINETSU CHEMICAL CO49 citations90
US8022137B2Sep 20, 2011
Silicone resin composition for optical semiconductor devices
SHINETSU CHEMICAL CO9 citations84
US8013057B2Sep 6, 2011
White thermosetting silicone resin composition for molding an optical semiconductor case and optical semiconductor case
SHINETSU CHEMICAL CO15 citations84
US7095125B2Aug 22, 2006
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO15 citations84
US6399677B2Jun 4, 2002
Epoxy resin compositions and premolded semiconductor packages
SHINETSU CHEMICAL CO14 citations84
US6297306B1Oct 2, 2001
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO15 citations84
US8013056B2Sep 6, 2011
White heat-curable silicone resin composition, optoelectronic part case, and molding method
SHINETSU CHEMICAL CO8 citations83
US5162400ANov 10, 1992
Epoxy resin compositions and semiconductor devices encapsulated therewith
SHINETSU CHEMICAL CO18 citations82
US4701479AOct 20, 1987
Epoxy resin-based composition for encapsulation of semiconductor devices
SHINETSU CHEMICAL CO20 citations82
US5312878AMay 17, 1994
Naphthalene containing epoxy resin cured with a dicyclopentadiene phenolic resin
SHINETSU CHEMICAL CO19 citations80
US6783859B2Aug 31, 2004
Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO10 citations74
US6518332B2Feb 11, 2003
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
SHINETSU CHEMICAL CO9 citations74
US6231997B1May 15, 2001
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices
SHINETSU CHEMICAL CO12 citations74
US6160078ADec 12, 2000
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO10 citations74
US6139978AOct 31, 2000
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
SHINETSU CHEMICAL CO10 citations74
US5250637AOct 5, 1993
Semiconductor encapsulating epoxy resin compositions and semiconductor devices
SHINETSU CHEMICAL CO16 citations74
US5225484AJul 6, 1993
Epoxy resin compositions and cured products thereof
SHINETSU CHEMICAL CO16 citations74
US5190995AMar 2, 1993
Naphthalene ring containing epoxy resin composition and semiconductor device encapsulated therewith
SHINETSU CHEMICAL CO13 citations74
US5166228ANov 24, 1992
Epoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewith
SHINETSU CHEMICAL CO18 citations74
US5053445AOct 1, 1991
Epoxy resin composition
SHINETSU CHEMICAL CO12 citations74
US7122587B2Oct 17, 2006
Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO10 citations72
US6723452B2Apr 20, 2004
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO9 citations72
US5173544ADec 22, 1992
Epoxy resin compositions
SHINETSU CHEMICAL CO12 citations72
US5300588AApr 5, 1994
Thermosetting resin compositions
SHINETSU CHEMICAL CO15 citations70
US6291556B1Sep 18, 2001
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO5 citations63
US6027812AFeb 22, 2000
Encapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction product
SHINETSU CHEMICAL CO3 citations62
US6894091B2May 17, 2005
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO1 citations52
US5243058ASep 7, 1993
Allyl or propenyl group-containing naphthalene derivatives
SHINETSU CHEMICAL CO1 citations52
US5171869ADec 15, 1992
Allyl or propenyl group-containing naphthalene derivatives
SHINETSU CHEMICAL CO0 citations52
US7910638B2Mar 22, 2011
Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device
SHINETSU CHEMICAL CO1 citations48