P

Inventor

MIURA HIDEO

JP153 patents
⚠️ This page may combine multiple inventors who share the name “MIURA HIDEO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

34 patents
US6468845B1Oct 22, 2002

Semiconductor apparatus having conductive thin films and manufacturing apparatus therefor

HITACHI LTD80 citations99
US6090684AJul 18, 2000

Method for manufacturing semiconductor device

HITACHI LTD283 citations99
US5909052AJun 1, 1999

Semiconductor device having plural chips with the sides of the chips in face-to-face contact with each other in the same crystal plane

HITACHI LTD101 citations97
US6211576B1Apr 3, 2001

Semiconductor device

HITACHI LTD62 citations96
US5444302AAug 22, 1995

Semiconductor device including multi-layer conductive thin film of polycrystalline material

HITACHI LTD61 citations96
US4942452AJul 17, 1990

Lead frame and semiconductor device

HITACHI LTD72 citations95
US7253103B2Aug 7, 2007

Method for producing semiconductor devices that includes forming a copper film in contact with a ruthenium film

HITACHI LTD15 citations93
US6696765B2Feb 24, 2004

Multi-chip module

HITACHI LTD23 citations93
US6624513B1Sep 23, 2003

Semiconductor device with multilayer conductive structure formed on a semiconductor substrate

HITACHI LTD17 citations93
US6492829B1Dec 10, 2002

Contactor for inspection

HITACHI LTD18 citations93
US6489648B2Dec 3, 2002

Semiconductor device

HITACHI LTD29 citations93
US6337517B1Jan 8, 2002

Semiconductor device and method of fabricating same

HITACHI LTD21 citations93
US5683515ANov 4, 1997

Apparatus for manufacturing a semiconductor device having conductive then films

HITACHI LTD19 citations93
US5047837ASep 10, 1991

Semiconductor device with heat transfer cap

HITACHI LTD46 citations93
US6639315B2Oct 28, 2003

Semiconductor device and mounted semiconductor device structure

HITACHI LTD42 citations92
US6620704B2Sep 16, 2003

Method of fabricating low stress semiconductor devices with thermal oxide isolation

HITACHI LTD13 citations92
US6559027B2May 6, 2003

Semiconductor device and process for producing the sme

HITACHI LTD26 citations92
US6531785B2Mar 11, 2003

Semiconductor device

HITACHI LTD15 citations92
US6503803B2Jan 7, 2003

Method of fabricating a semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer

HITACHI LTD16 citations92
US6379998B1Apr 30, 2002

Semiconductor device and method for fabricating the same

HITACHI LTD20 citations92
US6376905B2Apr 23, 2002

Semiconductor package

HITACHI LTD36 citations92
US6358762B1Mar 19, 2002

Manufacture method for semiconductor inspection apparatus

HITACHI LTD38 citations92
US6326699B2Dec 4, 2001

Semiconductor device

HITACHI LTD15 citations92
US6242323B1Jun 5, 2001

Semiconductor device and process for producing the same

HITACHI LTD28 citations92
US6057241AMay 2, 2000

Method of manufacturing a semiconductor integrated circuit device

HITACHI LTD27 citations92
US6031288AFeb 29, 2000

Semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer and method of fabrication thereof

HITACHI LTD36 citations92
US5846869ADec 8, 1998

Method of manufacturing semiconductor integrated circuit device

HITACHI LTD36 citations92
US5670793ASep 23, 1997

Semiconductor device having a polycrystalline silicon film with crystal grains having a uniform orientation

HITACHI LTD22 citations92
US5101263AMar 31, 1992

Semiconductor device and method for manufacturing the same

HITACHI LTD27 citations92
US4987474AJan 22, 1991

Semiconductor device and method of manufacturing the same

HITACHI LTD41 citations92
US4739381AApr 19, 1988

Piezoresistive strain sensing device

HITACHI LTD34 citations92
USRE37690EMay 7, 2002

Lead frame and semiconductor device

HITACHI LTD25 citations91
US6265784B1Jul 24, 2001

Resin sealed semiconductor device having improved arrangement for reducing thermal stress within the device

HITACHI LTD32 citations91
US6566149B1May 20, 2003

Method for manufacturing substrate for inspecting semiconductor device

HITACHI LTD22 citations90

RENESAS TECH CORP

7 patents

FUJI PHOTO FILM CO LTD

3 patents

FUJIFILM CORP

2 patents

HITACHI ULSI SYS CO LTD

1 patent

TOYO SEIKAN KAISHA LTD

1 patent

NEC CORP

1 patent

TAISEI KAKO COMPANY LIMITED

1 patent

Showing the top 50 of 153 patents by PatentIndex Score.