Inventor
MIURA HIDEO
JP153 patents
⚠️ This page may combine multiple inventors who share the name “MIURA HIDEO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
34 patentsUS6468845B1Oct 22, 2002
Semiconductor apparatus having conductive thin films and manufacturing apparatus therefor
HITACHI LTD80 citations99
US6090684AJul 18, 2000
Method for manufacturing semiconductor device
HITACHI LTD283 citations99
US5909052AJun 1, 1999
Semiconductor device having plural chips with the sides of the chips in face-to-face contact with each other in the same crystal plane
HITACHI LTD101 citations97
US6211576B1Apr 3, 2001
Semiconductor device
HITACHI LTD62 citations96
US5444302AAug 22, 1995
Semiconductor device including multi-layer conductive thin film of polycrystalline material
HITACHI LTD61 citations96
US4942452AJul 17, 1990
Lead frame and semiconductor device
HITACHI LTD72 citations95
US7253103B2Aug 7, 2007
Method for producing semiconductor devices that includes forming a copper film in contact with a ruthenium film
HITACHI LTD15 citations93
US6696765B2Feb 24, 2004
Multi-chip module
HITACHI LTD23 citations93
US6624513B1Sep 23, 2003
Semiconductor device with multilayer conductive structure formed on a semiconductor substrate
HITACHI LTD17 citations93
US6492829B1Dec 10, 2002
Contactor for inspection
HITACHI LTD18 citations93
US6489648B2Dec 3, 2002
Semiconductor device
HITACHI LTD29 citations93
US6337517B1Jan 8, 2002
Semiconductor device and method of fabricating same
HITACHI LTD21 citations93
US5683515ANov 4, 1997
Apparatus for manufacturing a semiconductor device having conductive then films
HITACHI LTD19 citations93
US5047837ASep 10, 1991
Semiconductor device with heat transfer cap
HITACHI LTD46 citations93
US6639315B2Oct 28, 2003
Semiconductor device and mounted semiconductor device structure
HITACHI LTD42 citations92
US6620704B2Sep 16, 2003
Method of fabricating low stress semiconductor devices with thermal oxide isolation
HITACHI LTD13 citations92
US6559027B2May 6, 2003
Semiconductor device and process for producing the sme
HITACHI LTD26 citations92
US6531785B2Mar 11, 2003
Semiconductor device
HITACHI LTD15 citations92
US6503803B2Jan 7, 2003
Method of fabricating a semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer
HITACHI LTD16 citations92
US6379998B1Apr 30, 2002
Semiconductor device and method for fabricating the same
HITACHI LTD20 citations92
US6376905B2Apr 23, 2002
Semiconductor package
HITACHI LTD36 citations92
US6358762B1Mar 19, 2002
Manufacture method for semiconductor inspection apparatus
HITACHI LTD38 citations92
US6326699B2Dec 4, 2001
Semiconductor device
HITACHI LTD15 citations92
US6242323B1Jun 5, 2001
Semiconductor device and process for producing the same
HITACHI LTD28 citations92
US6057241AMay 2, 2000
Method of manufacturing a semiconductor integrated circuit device
HITACHI LTD27 citations92
US6031288AFeb 29, 2000
Semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer and method of fabrication thereof
HITACHI LTD36 citations92
US5846869ADec 8, 1998
Method of manufacturing semiconductor integrated circuit device
HITACHI LTD36 citations92
US5670793ASep 23, 1997
Semiconductor device having a polycrystalline silicon film with crystal grains having a uniform orientation
HITACHI LTD22 citations92
US5101263AMar 31, 1992
Semiconductor device and method for manufacturing the same
HITACHI LTD27 citations92
US4987474AJan 22, 1991
Semiconductor device and method of manufacturing the same
HITACHI LTD41 citations92
US4739381AApr 19, 1988
Piezoresistive strain sensing device
HITACHI LTD34 citations92
USRE37690EMay 7, 2002
Lead frame and semiconductor device
HITACHI LTD25 citations91
US6265784B1Jul 24, 2001
Resin sealed semiconductor device having improved arrangement for reducing thermal stress within the device
HITACHI LTD32 citations91
US6566149B1May 20, 2003
Method for manufacturing substrate for inspecting semiconductor device
HITACHI LTD22 citations90
RENESAS TECH CORP
7 patentsUS6982465B2Jan 3, 2006
Semiconductor device with CMOS-field-effect transistors having improved drain current characteristics
RENESAS TECH CORP121 citations98
US6686274B1Feb 3, 2004
Semiconductor device having cobalt silicide film in which diffusion of cobalt atoms is inhibited and its production process
RENESAS TECH CORP63 citations96
US6927489B1Aug 9, 2005
Semiconductor device provided with rewiring layer
RENESAS TECH CORP40 citations93
US6960832B2Nov 1, 2005
Semiconductor device and its production process
RENESAS TECH CORP22 citations92
US6821867B2Nov 23, 2004
Method for forming grooves in the scribe region to prevent a warp of a semiconductor substrate
RENESAS TECH CORP29 citations92
US6803294B2Oct 12, 2004
Semiconductor wafer and manufacturing method of semiconductor device
RENESAS TECH CORP20 citations92
US7358578B2Apr 15, 2008
Field effect transistor on a substrate with (111) orientation having zirconium oxide gate insulation and cobalt or nickel silicide wiring
RENESAS TECH CORP12 citations84
FUJI PHOTO FILM CO LTD
3 patentsFUJIFILM CORP
2 patentsHITACHI ULSI SYS CO LTD
1 patentTOYO SEIKAN KAISHA LTD
1 patentNEC CORP
1 patentTAISEI KAKO COMPANY LIMITED
1 patentShowing the top 50 of 153 patents by PatentIndex Score.