Inventor

LI MING-HSUN

TW4 patents

⚠️ This page may combine multiple inventors who share the name “LI MING-HSUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIPMOS TECHNOLOGIES INC

3 patents

US7936032B2May 3, 2011

Film type package for fingerprint sensor

CHIPMOS TECHNOLOGIES INC2 citations58

US7812422B2Oct 12, 2010

Film type package for fingerprint sensor

CHIPMOS TECHNOLOGIES INC1 citations48

US7732911B2Jun 8, 2010

Semiconductor packaging substrate improving capability of electrostatic dissipation

CHIPMOS TECHNOLOGIES INC1 citations47

CHEN TSUNG LUNG

1 patent

US8253235B2Aug 28, 2012

Semiconductor packaging substrate improving capability of electrostatic dissipation

CHEN TSUNG LUNG1 citations41